S8802 Heavy Cut Polishing Compound

Innovative abrasive formulation mordant grain, easy to use for the first polishing process. Abrasive mixture, with micro-granules it is recommended in presence of: sanding marks (up to grit P1500), parts heavily scratched or oxidizes by atmospheric agents. Silicone free. We suggest the use together with the HC-88 polishing pad for an excellent result with a unique gloss.
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